Width in mm
-
Height in mm
-
Base thickness in mm
-
3776_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Width / mm: 18.9
Height / mm: 4.8
Base height / mm: 1.0
Gewicht / kg/m: 12.0
PR 8
3813_1_Titel
Width / mm: 20.0
Height / mm: 50.0
Base height / mm: 2.3
PR 139
32721_1_Titel
Width / mm: 20.0
Height / mm: 10.0
Base height / mm: 1.75
PR 45
5411_1_Titel
Width / mm: 22.0
Height / mm: 12.0
Gewicht / kg/m: 46.0
PR 6
404_1_Titel
Width / mm: 23.0
Height / mm: 30.0
Base height / mm: 6.0
PR 290
32718_1_Titel
Width / mm: 25.0
Height / mm: 5.0
Base height / mm: 1.5
PR 46
2208_1_Titel
Width / mm: 25.0
Height / mm: 54.0
PR 118
3777_1_Titel
Width / mm: 29.0
Height / mm: 12.0
Base height / mm: 2.5
PR 20
3883_1_Titel
Width / mm: 29.0
Height / mm: 12.0
Base height / mm: 3.0
PR 23
1186_1_Titel
Width / mm: 30.0
Height / mm: 28.0
PR 234