Calculate thermal parameters
Heat sink temperature::
Thermal resistance:
Allowed junction temperature of the semiconductor
Heat resistance between heat sink and electrical package
Thermal dissipation loss
Heat resistance between heat sink and electrical package
Ambient temperature

Width [mm]: | 104.5 | |
Height [mm]: | 80.0 | |
Maximale Wärmeabfuhr [K]: | 40.0 | |
Gesamtlänge [mm]: | 278.0 | |
Druckkammerlänge [mm]: | 200.0 | |
Lufttemperaturerhöhung [K/W]: | 0.09 | |
Min. thermal resistance [K/W]: | 0.13 | |
Unit Weight [g]: | 2300.0 | |
Max. power loss | 200.0 |
LK 10/200/A

Width [mm]: | 140.0 | |
Height [mm]: | 120.0 | |
Maximale Wärmeabfuhr [K]: | 40.0 | |
Gesamtlänge [mm]: | 293.0 | |
Druckkammerlänge [mm]: | 200.0 | |
Lufttemperaturerhöhung [K/W]: | 0.03 | |
Min. thermal resistance [K/W]: | 0.07 | |
Unit Weight [g]: | 4200.0 | |
Max. power loss | 400.0 |
LK 30/200/A

Width [mm]: | 182.0 | |
Height [mm]: | 80.0 | |
Maximale Wärmeabfuhr [K]: | 40.0 | |
Gesamtlänge [mm]: | 278.0 | |
Druckkammerlänge [mm]: | 200.0 | |
Lufttemperaturerhöhung [K/W]: | 0.05 | |
Min. thermal resistance [K/W]: | 0.07 | |
Unit Weight [g]: | 4046.0 | |
Max. power loss | 400.0 |
LK 20/200/A

Width [mm]: | 210.0 | |
Height [mm]: | 130.0 | |
Maximale Wärmeabfuhr [K]: | 40.0 | |
Gesamtlänge [mm]: | 310.0 | |
Druckkammerlänge [mm]: | 200.0 | |
Lufttemperaturerhöhung [K/W]: | 0.013 | |
Min. thermal resistance [K/W]: | 0.044 | |
Unit Weight [g]: | 5220.0 | |
Max. power loss | 625.0 |
LK 40/200/Q