Calculate thermal parameters
Kühlkörpertemperatur:
Thermischer Widerstand:
Zulässige Sperrschicht-temperatur des Halbleiters
Übergangswiderstand Sperrschicht-Halbleitergehäuse
Thermal dissipation loss
Heat resistance between heat sink and electrical package
Ambient temperature

Finish | Blank Aluminium | |
Material | AlMgSi0,5 | |
Width [mm]: | 12.0 | |
Height [mm]: | 15.0 | |
Base height [mm]: | 1.5 | |
Alloy | AlMgSi 0,5 F22 | |
Weight per meter [kg/m]: | 0.15 |
PR 10

Finish | Blank Aluminium | |
Material | AlMgSi0,5 | |
Width [mm]: | 12.6 | |
Height [mm]: | 6.5 | |
Alloy | AlMgSi 0,5 F22 | |
Weight per meter [kg/m]: | 0.15 |
PR 5

Width [mm]: | 14.0 | |
Height [mm]: | 10.0 | |
Base height [mm]: | 2.2 | |
Alloy | AlMgSi 0,5 F22 | |
Weight per meter [kg/m]: | 0.20 |
PR 44

Finish | Blank Aluminium | |
Material | AlMgSi0,5 | |
Width [mm]: | 15.0 | |
Height [mm]: | 30.0 | |
Base height [mm]: | 2.0 | |
Alloy | AlMgSi 0,5 F22 | |
Weight per meter [kg/m]: | 0.36 |
PR 15

Finish | Blank Aluminium | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.0 | |
Height [mm]: | 20.0 | |
Base height [mm]: | 1.5 | |
Alloy | AlMgSi 0,5 F22 | |
Weight per meter [kg/m]: | 0.22 |
PR 18

Semiconductor casing: | DIL | |
Semiconductor mounted by: | Bonding | |
Heat sink mounted by: | Adhesive Bounding | |
Finish | Blank Aluminium | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.9 | |
Height [mm]: | 4.8 | |
Base height [mm]: | 1.0 | |
Alloy | AlMgSi 0,5 F22 | |
Weight per meter [kg/m]: | 0.13 |
PR 8