Calculate thermal parameters
Heat sink temperature::
Thermal resistance:
Allowed junction temperature of the semiconductor
Heat resistance between heat sink and electrical package
Thermal dissipation loss
Heat resistance between heat sink and electrical package
Ambient temperature

Semiconductor casing: | DIL | |
Semiconductor mounted by: | Bonding | |
Heat sink mounted by: | Adhesive Bounding | |
Finish | Blank Aluminium | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.9 | |
Height [mm]: | 4.8 | |
Base height [mm]: | 1.0 | |
Alloy | AlMgSi 0,5 F22 | |
Weight per meter [kg/m]: | 0.13 |
PR 8

Width [mm]: | 20.0 | |
Height [mm]: | 50.0 | |
Base height [mm]: | 2.3 | |
Alloy | AlMgSi 0,5 F22 | |
Weight per meter [kg/m]: | 1.08 |
PR 139

Width [mm]: | 29.0 | |
Height [mm]: | 12.0 | |
Base height [mm]: | 3.0 | |
Alloy | AlMgSi 0,5 F22 | |
Weight per meter [kg/m]: | 0.40 |
PR 23

Width [mm]: | 29.0 | |
Height [mm]: | 12.0 | |
Base height [mm]: | 2.5 | |
Alloy | AlMgSi 0,5 F22 | |
Weight per meter [kg/m]: | 0.39 |
PR 20