3048_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.0
Height [mm]: 20.0
Length [mm]: 15.0
Min. thermal resistance [K/W]: 20.0
PR 18/15/SE
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3050_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.0
Height [mm]: 20.0
Length [mm]: 35.0
Min. thermal resistance [K/W]: 13.0
PR 18/35/SE
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3049_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.0
Height [mm]: 20.0
Length [mm]: 25.0
Min. thermal resistance [K/W]: 17.0
PR 18/25/SE
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3038_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 33.0
Standardlänge [mm]: 33.0
Min. thermal resistance [K/W]: 13.0
PR 8/33/SE
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3040_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 47.0
Standardlänge [mm]: 47.0
Min. thermal resistance [K/W]: 9.0
PR 8/47/SE
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3041_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 51.0
Standardlänge [mm]: 51.0
Min. thermal resistance [K/W]: 8.0
PR 8/51/SE
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3037_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 6.3
Standardlänge [mm]: 6.3
Min. thermal resistance [K/W]: 50.0
PR 8/6,3/SE
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3039_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 37.0
Standardlänge [mm]: 37.0
Min. thermal resistance [K/W]: 11.0
PR 8/37/SE
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23332_1_Titel
Semiconductor casing: PGA ; BGA ; IC
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Width [mm]: 20.0
Height [mm]: 10.0
Length [mm]: 20.0
Min. thermal resistance [K/W]: 18.0
PG 2020/10/SE/SF
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3068_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 20.0
Height [mm]: 50.0
Length [mm]: 94.0
Min. thermal resistance [K/W]: 3.0
PR 139/94/SE/M 3
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