
Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Screw | |
Heat sink mounted by: | Srew-On | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.0 | |
Height [mm]: | 20.0 | |
Length [mm]: | 15.0 | |
Min. thermal resistance [K/W]: | 20.0 |
PR 18/15/SE
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Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Screw | |
Heat sink mounted by: | Srew-On | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.0 | |
Height [mm]: | 20.0 | |
Length [mm]: | 35.0 | |
Min. thermal resistance [K/W]: | 13.0 |
PR 18/35/SE
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Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Screw | |
Heat sink mounted by: | Srew-On | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.0 | |
Height [mm]: | 20.0 | |
Length [mm]: | 25.0 | |
Min. thermal resistance [K/W]: | 17.0 |
PR 18/25/SE
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Semiconductor casing: | DIL | |
Semiconductor mounted by: | Bonding | |
Heat sink mounted by: | Adhesive Bounding | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.9 | |
Height [mm]: | 4.8 | |
Length [mm]: | 33.0 | |
Standardlänge [mm]: | 33.0 | |
Min. thermal resistance [K/W]: | 13.0 |
PR 8/33/SE
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Semiconductor casing: | DIL | |
Semiconductor mounted by: | Bonding | |
Heat sink mounted by: | Adhesive Bounding | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.9 | |
Height [mm]: | 4.8 | |
Length [mm]: | 47.0 | |
Standardlänge [mm]: | 47.0 | |
Min. thermal resistance [K/W]: | 9.0 |
PR 8/47/SE
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Semiconductor casing: | DIL | |
Semiconductor mounted by: | Bonding | |
Heat sink mounted by: | Adhesive Bounding | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.9 | |
Height [mm]: | 4.8 | |
Length [mm]: | 51.0 | |
Standardlänge [mm]: | 51.0 | |
Min. thermal resistance [K/W]: | 8.0 |
PR 8/51/SE
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Semiconductor casing: | DIL | |
Semiconductor mounted by: | Bonding | |
Heat sink mounted by: | Adhesive Bounding | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.9 | |
Height [mm]: | 4.8 | |
Length [mm]: | 6.3 | |
Standardlänge [mm]: | 6.3 | |
Min. thermal resistance [K/W]: | 50.0 |
PR 8/6,3/SE
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Semiconductor casing: | DIL | |
Semiconductor mounted by: | Bonding | |
Heat sink mounted by: | Adhesive Bounding | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.9 | |
Height [mm]: | 4.8 | |
Length [mm]: | 37.0 | |
Standardlänge [mm]: | 37.0 | |
Min. thermal resistance [K/W]: | 11.0 |
PR 8/37/SE
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Semiconductor casing: | PGA ; BGA ; IC | |
Semiconductor mounted by: | Bonding | |
Heat sink mounted by: | Adhesive Bounding | |
Width [mm]: | 20.0 | |
Height [mm]: | 10.0 | |
Length [mm]: | 20.0 | |
Min. thermal resistance [K/W]: | 18.0 |
PG 2020/10/SE/SF
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Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Clip Mounting | |
Heat sink mounted by: | Srew-On | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 20.0 | |
Height [mm]: | 50.0 | |
Length [mm]: | 94.0 | |
Min. thermal resistance [K/W]: | 3.0 |
PR 139/94/SE/M 3
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