Heat sink for PCB mounting
The heat sinks for PCB mounting are optimised for mounting directly on the PCB "printed circuit board".
| Semiconductor casing: | TO-220 | |
| Semiconductor mounted by: | Screw | |
| Heat sink mounted by: | Srew-On | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 18.0 | |
| Height [mm]: | 20.0 | |
| Length [mm]: | 25.0 | |
| Min. thermal resistance [K/W]: | 17.0 |
| Semiconductor casing: | TO-220 | |
| Semiconductor mounted by: | Screw | |
| Heat sink mounted by: | Srew-On | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 18.0 | |
| Height [mm]: | 20.0 | |
| Length [mm]: | 35.0 | |
| Min. thermal resistance [K/W]: | 13.0 |
| Semiconductor casing: | TO-220 | |
| Semiconductor mounted by: | Screw | |
| Heat sink mounted by: | Srew-On | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 18.0 | |
| Height [mm]: | 20.0 | |
| Length [mm]: | 15.0 | |
| Min. thermal resistance [K/W]: | 20.0 |
| Semiconductor casing: | DIL | |
| Semiconductor mounted by: | Bonding | |
| Heat sink mounted by: | Adhesive Bounding | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 18.9 | |
| Height [mm]: | 4.8 | |
| Length [mm]: | 51.0 | |
| Standardlänge [mm]: | 51.0 | |
| Min. thermal resistance [K/W]: | 8.0 |
| Semiconductor casing: | DIL | |
| Semiconductor mounted by: | Bonding | |
| Heat sink mounted by: | Adhesive Bounding | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 18.9 | |
| Height [mm]: | 4.8 | |
| Length [mm]: | 47.0 | |
| Standardlänge [mm]: | 47.0 | |
| Min. thermal resistance [K/W]: | 9.0 |
| Semiconductor casing: | DIL | |
| Semiconductor mounted by: | Bonding | |
| Heat sink mounted by: | Adhesive Bounding | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 18.9 | |
| Height [mm]: | 4.8 | |
| Length [mm]: | 37.0 | |
| Standardlänge [mm]: | 37.0 | |
| Min. thermal resistance [K/W]: | 11.0 |
| Semiconductor casing: | DIL | |
| Semiconductor mounted by: | Bonding | |
| Heat sink mounted by: | Adhesive Bounding | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 18.9 | |
| Height [mm]: | 4.8 | |
| Length [mm]: | 33.0 | |
| Standardlänge [mm]: | 33.0 | |
| Min. thermal resistance [K/W]: | 13.0 |
| Semiconductor casing: | DIL | |
| Semiconductor mounted by: | Bonding | |
| Heat sink mounted by: | Adhesive Bounding | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 18.9 | |
| Height [mm]: | 4.8 | |
| Length [mm]: | 6.3 | |
| Standardlänge [mm]: | 6.3 | |
| Min. thermal resistance [K/W]: | 50.0 |
| Semiconductor casing: | TO-220 | |
| Semiconductor mounted by: | Clip Mounting | |
| Heat sink mounted by: | Srew-On | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 20.0 | |
| Height [mm]: | 50.0 | |
| Length [mm]: | 94.0 | |
| Min. thermal resistance [K/W]: | 3.0 |
| Semiconductor casing: | PGA ; BGA ; IC | |
| Semiconductor mounted by: | Bonding | |
| Heat sink mounted by: | Adhesive Bounding | |
| Width [mm]: | 20.0 | |
| Height [mm]: | 10.0 | |
| Length [mm]: | 20.0 | |
| Min. thermal resistance [K/W]: | 18.0 |
