General parameters

Length [mm]
-
Width [mm]:
-
Height [mm]:
-


3052_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 17.5
Height [mm]: 55.0
Length [mm]: 35.0
Min. thermal resistance [K/W]: 7.0
PR 16/35/SE
3048_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.0
Height [mm]: 20.0
Length [mm]: 15.0
Min. thermal resistance [K/W]: 20.0
PR 18/15/SE
3050_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.0
Height [mm]: 20.0
Length [mm]: 35.0
Min. thermal resistance [K/W]: 13.0
PR 18/35/SE
3049_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.0
Height [mm]: 20.0
Length [mm]: 25.0
Min. thermal resistance [K/W]: 17.0
PR 18/25/SE
3039_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 37.0
Min. thermal resistance [K/W]: 11.0
PR 8/37/SE
3040_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 47.0
Min. thermal resistance [K/W]: 9.0
PR 8/47/SE
3041_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 51.0
Min. thermal resistance [K/W]: 8.0
PR 8/51/SE
3037_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 6.3
Min. thermal resistance [K/W]: 50.0
PR 8/6,3/SE
3038_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 33.0
Min. thermal resistance [K/W]: 13.0
PR 8/33/SE
23332_1_Titel
Semiconductor casing: PGA ; BGA ; IC
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Width [mm]: 20.0
Height [mm]: 10.0
Length [mm]: 20.0
Min. thermal resistance [K/W]: 18.0
PG 2020/10/SE/SF