PG 2828/8/SE/SF
Product features
| Semiconductor casing: | PGA ; BGA ; IC | |
| Semiconductor mounted by: | Bonding | |
| Heat sink mounted by: | Adhesive Bounding | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 28.0 | |
| Height [mm]: | 8.0 | |
| Length [mm]: | 28.0 | |
| Min. thermal resistance [K/W]: | 11.0 |
- Heatsinks for microprocessors (Extrusion Technology) - Direct mounting with self-adhesive foil - Best possible heat radiation from black anodized surface - RthKvalues apply to natural convection (without external ventilation) - Arrangement and number of pins for optimal air flow - Even heat distribution in the base and the pins in the direction of heat flow - Suitable for forced and free convection - Aluminium alloy Al MgSi 0.5 - Thermal conductivity: 180-200 W / mK - Other dimensions and surface finishes by request
