FI 306/SN
Product features
| Semiconductor casing: | TO-220 | |
| Semiconductor mounted by: | Screw | |
| Heat sink mounted by: | Solder | |
| Finish | Tin Plated | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 25.4 | |
| Height [mm]: | 29.3 | |
| Length [mm]: | 12.7 | |
| Min. thermal resistance [K/W]: | 22.0 |
Standard heat sin for single device mounting
