FI 340/31,8/SL/TO3
Product features
| Semiconductor casing: | TO-3 | |
| Semiconductor mounted by: | Screw | |
| Heat sink mounted by: | Srew-On | |
| Finish | Blackened | |
| Material | AlSiCu 3 | |
| Width [mm]: | 40.5 | |
| Height [mm]: | 31.8 | |
| Length [mm]: | 46.0 | |
| Min. thermal resistance [K/W]: | 4.0 |
Finger shaped heatsink from die-casting aluminium with or without hole pattern for semiconductor case TO3. Standard heights: 12,7; 19,1; 25,4; and 31,8 mm. Space saving construction. Turbulence in every installation position.
