|Semiconductor mounted by:||Screw|
|Heat sink mounted by:||Srew-On|
|Min. thermal resistance [K/W]:||4.0|
Finger shaped heatsink from die-casting aluminium with or without hole pattern for semiconductor case TO3. Standard heights: 12,7; 19,1; 25,4; and 31,8 mm. Space saving construction. Turbulence in every installation position.