FI 340/31,8/SL/TO3

Product features

Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Blackened
Material AlSiCu 3
Width [mm]: 40.5
Height [mm]: 31.8
Length [mm]: 46.0
Min. thermal resistance [K/W]: 4.0

Finger shaped heatsink from die-casting aluminium with or without hole pattern for semiconductor case TO3. Standard heights: 12,7; 19,1; 25,4; and 31,8 mm. Space saving construction. Turbulence in every installation position.

Product pictures

1 / 2
5770_1_Titel style=
2 / 2
5770_4_Detail1 style=