FI 355/19/SE
Product features
| Semiconductor casing: | TO-220 | |
| Semiconductor mounted by: | Screw | |
| Heat sink mounted by: | Srew-On | |
| Finish | Black Anodised | |
| Material | Al99,5 | |
| Width [mm]: | 22.0 | |
| Height [mm]: | 19.2 | |
| Length [mm]: | 19.0 | |
| Min. thermal resistance [K/W]: | 21.0 |
Finger shaped heatsink, for semiconductor case TO 220. For screw and rivet mounting Turbulence in every installation position
