FI 311/SE
Product features
Semiconductor casing: | TO-220 ; SOT-32 ; TO-3 ; TO-66 ; TO-9 | |
Semiconductor mounted by: | Screw | |
Heat sink mounted by: | Srew-On | |
Finish | Black Anodised | |
Material | Al99,5 | |
Width [mm]: | 46.0 | |
Height [mm]: | 12.7 | |
Length [mm]: | 46.0 | |
Min. thermal resistance [K/W]: | 7.0 |
Finger shaped heatsink, with universal hole pattern, for semiconductor case TO3; TO66; SOT9; SOT32 and TO 220. Space saving construction. Turbulence in every installation position.