FI 311/SE
Product features
| Semiconductor casing: | TO-220 ; SOT-32 ; TO-3 ; TO-66 ; TO-9 | |
| Semiconductor mounted by: | Screw | |
| Heat sink mounted by: | Srew-On | |
| Finish | Black Anodised | |
| Material | Al99,5 | |
| Width [mm]: | 46.0 | |
| Height [mm]: | 12.7 | |
| Length [mm]: | 46.0 | |
| Min. thermal resistance [K/W]: | 7.0 |
Finger shaped heatsink, with universal hole pattern, for semiconductor case TO3; TO66; SOT9; SOT32 and TO 220. Space saving construction. Turbulence in every installation position.
