FI 311/SE

Product features

Semiconductor casing: TO-220 ; SOT-32 ; TO-3 ; TO-66 ; TO-9
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material Al99,5
Width [mm]: 46.0
Height [mm]: 12.7
Length [mm]: 46.0
Min. thermal resistance [K/W]: 7.0

Finger shaped heatsink, with universal hole pattern, for semiconductor case TO3; TO66; SOT9; SOT32 and TO 220. Space saving construction. Turbulence in every installation position.

Product pictures

1 / 2
5752_1_Titel style=
2 / 2
5752_4_Detail1 style=