PR 33/50,8/SE
Product features
Semiconductor casing: | TO-220 ; TO-218 ; TOP-3 | |
Semiconductor mounted by: | Screw | |
Heat sink mounted by: | Solder | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 42.0 | |
Height [mm]: | 25.0 | |
Length [mm]: | 50.8 | |
Min. thermal resistance [K/W]: | 4.0 |
- Special extruded heatsink for semiconductor case TO220, TO218(TOP3) - Aluminium, anodised black, solderable - Standard heights: 25.4, 38.1, 50.8 and 63.5 mm - 2 x 3.2 mm holes for semiconductor assembly - Heatsink solderable by tin plated solder pins