PR 31/63/MC
Product features
Semiconductor casing: | TO-220 ; TO-218 ; TOP-3 | |
Semiconductor mounted by: | Clip Mounting | |
Heat sink mounted by: | Solder | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 35.0 | |
Height [mm]: | 25.4 | |
Length [mm]: | 63.0 | |
Min. thermal resistance [K/W]: | 4.0 |
- Special extruded heatsink for semiconductor case TO220, TO218(TOP3) - Aluminium, anodised black, solderable - Standard heights: 38, 50 and 63 mm - Version MC (Mounting clip) for clip mounting of semiconductor. - Heatsink solderable by tin plated solder pins