FI 310/SE
Product features
| Semiconductor mounted by: | Screw | |
| Heat sink mounted by: | Srew-On | |
| Finish | Black Anodised | |
| Material | Al99,5 | |
| Width [mm]: | 46.0 | |
| Height [mm]: | 12.7 | |
| Length [mm]: | 46.0 | |
| Min. thermal resistance [K/W]: | 7.0 |
Finger shaped heatsink, with no hole pattern, e.g. for semiconductor case TO3. Space saving construction. Turbulence in every installation position.
