FI 300/SE
Product features
| Semiconductor casing: | TO-220 | |
| Semiconductor mounted by: | Screw | |
| Heat sink mounted by: | Clip-On | |
| Finish | Black Anodised | |
| Material | Al99,5 | |
| Width [mm]: | 22.0 | |
| Height [mm]: | 31.6 | |
| Length [mm]: | 4.0 | |
| Min. thermal resistance [K/W]: | 27.0 |
Standard heat sink for single device mounting
