5857_1_Titel
Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Thickness [mm]: 0.23
Insulation capacity: 2.0
Questions on the product
SI 481
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5860_1_Titel
Semiconductor casing: SOT-32
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 3.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI 485
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5862_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI 487-S
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5863_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI 488
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5864_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.23
Insulation capacity: 5.0
Dielectric coefficient 2.0
Questions on the product
SI 489
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5865_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI 490
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5868_1_Titel
Semiconductor casing: Multiwatt
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 5.0
Dielectric coefficient 2.0
Temperature resistance 200.0
Questions on the product
SI 492
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5873_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 2.0
Thickness [mm]: 0.23
Insulation capacity: 5.0
Dielectric coefficient 2.0
Questions on the product
SI 498-S
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5875_1_Titel
Semiconductor casing: Quarze
Semiconductor mounted by: Stick On
Material Silicon w. Glasfibre
Thickness [mm]: 0.23
Insulation capacity: 5.0
Dielectric coefficient 2.0
Questions on the product
SI 499
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6155_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Questions on the product
IL 557/35
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