5857_1_Titel
Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Thickness / mm: 0.23
Insulation capacity: 2.0
SI 481
5856_1_Titel
Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Thickness / mm: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
SI 480
2419_1_Titel
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Thickness / mm: 0.23
Dielectric coefficient 2.0
SI 4023-S
5851_1_Titel
Material Silicon w. Glasfibre
Thickness / mm: 0.23
Dielectric coefficient 2.0
SI 4023
12960_1_Titel
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Thickness / mm: 0.18
Dielectric coefficient 2.0
SI 4018-S
5850_1_Titel
Material Silicon w. Glasfibre
Thickness / mm: 0.18
Dielectric coefficient 2.0
SI 4018
29392_1_Titel
Material Silicon free
Content 50.0
PA 701/50g
5837_1_Titel
Material Silicon free
Content 500.0
PA 701/500g
5835_1_Titel
Material Silicon free
Content 250.0
PA 701/250g
5844_1_Titel
Material Silicon free
Content 20.0
PA 701/20g