31030_1_Titel
Semiconductor mounted by: Clip Mounting ; Bonding
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
SI7006-S
5799_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.05
Insulation capacity: 2.0
Temperature resistance 550.0
GL 530
29392_1_Titel
Material Silicon free
Content 50.0
PA 701/50g
5837_1_Titel
Material Silicon free
Content 500.0
PA 701/500g
5835_1_Titel
Material Silicon free
Content 250.0
PA 701/250g
5844_1_Titel
Material Silicon free
Content 20.0
PA 701/20g
5843_1_Titel
Material Silicon free
Content 10.0
PA 701/10g
29393_1_Titel
Material Silicon free
Content 100.0
PA 701/100g
6155_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 557/35
11939_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 557/30