31027_1_Titel
Semiconductor casing: TO-247
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
SI7003
31026_1_Titel
Semiconductor casing: TO-126 ; SOT-32
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
SI7002
31025_1_Titel
Semiconductor casing: TO-126 ; SOT-32
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
SI7001
5452_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Thickness [mm]: 0.23
Insulation capacity: 5.0
Dielectric coefficient 2.0
SI 6023-S
2962_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
SI 6018-S
5875_1_Titel
Semiconductor casing: Quarze
Semiconductor mounted by: Stick On
Material Silicon w. Glasfibre
Thickness [mm]: 0.23
Insulation capacity: 5.0
Dielectric coefficient 2.0
SI 499
5873_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 2.0
Thickness [mm]: 0.23
Insulation capacity: 5.0
Dielectric coefficient 2.0
SI 498-S
7755_1_Titel
Semiconductor casing: Quarze
Semiconductor mounted by: Stick On
Material Silicon w. Glasfibre
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
SI 497
5868_1_Titel
Semiconductor casing: Multiwatt
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 5.0
Dielectric coefficient 2.0
Temperature resistance 200.0
SI 492
5865_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
SI 490