5841_1_Titel
Material Contains silicon
Content 20.0
PA 700/20g
5839_1_Titel
Material Contains silicon
Content 10.0
PA 700/10g
29390_1_Titel
Material Contains silicon
Content 100.0
PA 700/100g
Semiconductor casing: Dioden
Semiconductor mounted by: Screw
Material Makrolone
Diameter [mm]: 9.5
Inner diameter [mm]: 4.1
Outer diameter [mm]: 6.4
Thickness [mm]: 2.5
Insulation capacity: 30.0
Temperature resistance 130.0
IS 585
5818_1_Titel
Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material Makrolone
Diameter [mm]: 7.5
Inner diameter [mm]: 3.1
Outer diameter [mm]: 3.9
Thickness [mm]: 0.4
Insulation capacity: 30.0
Temperature resistance 130.0
IS 580
5814_1_Titel
Semiconductor casing: TO-218 ; TOP-3 ; TO-220 ; Multiwatt
Semiconductor mounted by: Screw
Material Makrolone
Diameter [mm]: 7.1
Inner diameter [mm]: 3.1
Outer diameter [mm]: 3.8
Thickness [mm]: 0.35
Insulation capacity: 30.0
Temperature resistance 130.0
IS 570
5812_1_Titel
Semiconductor casing: TO-218 ; TOP-3 ; TO-220 ; Multiwatt
Semiconductor mounted by: Screw
Material Makrolone
Diameter [mm]: 6.4
Inner diameter [mm]: 3.1
Outer diameter [mm]: 3.8
Thickness [mm]: 0.35
Insulation capacity: 30.0
Temperature resistance 130.0
IS 565
5810_1_Titel
Semiconductor casing: TO-218 ; TOP-3 ; TO-220 ; Multiwatt
Semiconductor mounted by: Screw
Material Makrolone
Diameter [mm]: 6.0
Inner diameter [mm]: 3.1
Outer diameter [mm]: 3.5
Thickness [mm]: 0.2
Insulation capacity: 30.0
Temperature resistance 130.0
IS 560
12389_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material MICA
Thickness [mm]: 0.05
Insulation capacity: 2.0
GL 535/N
5794_1_Titel
Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material MICA
Insulation capacity: 2.0
Temperature resistance 550.0
GL 510