Calculate thermal parameters
Heat sink temperature::
Thermal resistance:
Allowed junction temperature of the semiconductor
Heat resistance between heat sink and electrical package
Thermal dissipation loss
Heat resistance between heat sink and electrical package
Ambient temperature

Semiconductor casing: | TO-218 ; TOP-3 | |
Semiconductor mounted by: | Stick On ; Clip Mounting | |
Material | Silicon Rubber | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.3 | |
Insulation capacity: | 10.0 | |
Dielectric coefficient | 4.0 |
IL 557/35

Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Stick On ; Clip Mounting | |
Material | Silicon Rubber | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.3 | |
Insulation capacity: | 10.0 | |
Dielectric coefficient | 4.0 |
IK 550

Semiconductor casing: | TO-218 ; TOP-3 | |
Semiconductor mounted by: | Stick On ; Clip Mounting | |
Material | Silicon Rubber | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.3 | |
Insulation capacity: | 10.0 | |
Dielectric coefficient | 4.0 |
IK 553

Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Stick On ; Clip Mounting | |
Material | Silicon Rubber |
IL 555/25

Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Stick On ; Clip Mounting | |
Material | Silicon Rubber | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.3 | |
Insulation capacity: | 10.0 | |
Dielectric coefficient | 4.0 |
IL 555/30

Semiconductor casing: | TO-218 ; TOP-3 | |
Semiconductor mounted by: | Stick On ; Clip Mounting | |
Material | Silicon Rubber | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.3 | |
Insulation capacity: | 10.0 | |
Dielectric coefficient | 4.0 |
IL 557/30

Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Stick On ; Clip Mounting | |
Material | Silicon Rubber | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.3 | |
Insulation capacity: | 10.0 | |
Dielectric coefficient | 4.0 |
IK 552