Semiconductor Casing
11932_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IK 550
34220_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IK 552
11934_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IK 553
11936_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
IL 555/25
11937_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 555/30
11939_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 557/30
6155_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 557/35