Semiconductor casing:
TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IK 550
Semiconductor casing:
TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IK 552
Semiconductor casing:
TO-218
;
TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IK 553
Semiconductor casing:
TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
IL 555/25
Semiconductor casing:
TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 555/30
Semiconductor casing:
TO-218
;
TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 557/30
Semiconductor casing:
TO-218
;
TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 557/35
