6155_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
11932_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
11934_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
11936_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
11937_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
11939_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
34220_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0