General parameters

Semiconductor Casing


6155_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 557/35
11939_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 557/30
11937_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IL 555/30
11936_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
IL 555/25
11934_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IK 553
34220_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IK 552
11932_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Stick On
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
IK 550