Calculate thermal parameters
Heat sink temperature::
Thermal resistance:
Allowed junction temperature of the semiconductor
Heat resistance between heat sink and electrical package
Thermal dissipation loss
Heat resistance between heat sink and electrical package
Ambient temperature

Semiconductor casing: | TO-3 | |
Semiconductor mounted by: | Screw | |
Material | MICA | |
Insulation capacity: | 2.0 | |
Temperature resistance | 550.0 |
GL 510

Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Screw | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.05 | |
Insulation capacity: | 2.0 | |
Temperature resistance | 550.0 |
GL 530

Semiconductor casing: | TO-218 ; TOP-3 | |
Semiconductor mounted by: | Screw | |
Material | MICA | |
Thickness [mm]: | 0.05 | |
Insulation capacity: | 2.0 |
GL 535/N