Calculate thermal parameters


Heat sink temperature::
Thermal resistance:

Allowed junction temperature of the semiconductor
Heat resistance between heat sink and electrical package
Thermal dissipation loss
Heat resistance between heat sink and electrical package
Ambient temperature
5794_1_Titel
Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material MICA
Insulation capacity: 2.0
Temperature resistance 550.0
GL 510
5799_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.05
Insulation capacity: 2.0
Temperature resistance 550.0
GL 530
12389_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material MICA
Thickness [mm]: 0.05
Insulation capacity: 2.0
GL 535/N