General parameters

Semiconductor Casing
Device mounted by
Insulation and Heat Conduction

12389_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material MICA
Thickness [mm]: 0.05
Insulation capacity: 2.0
GL 535/N
5794_1_Titel
Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material MICA
Insulation capacity: 2.0
Temperature resistance 550.0
GL 510
5799_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.05
Insulation capacity: 2.0
Temperature resistance 550.0
GL 530