Semiconductor Casing
Device mounted by
5794_1_Titel
Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material MICA
Insulation capacity: 2.0
Temperature resistance in K 550.0
GL 510
5799_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.05
Insulation capacity: 2.0
Temperature resistance in K 550.0
GL 530
12389_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material MICA
Thickness / mm: 0.05
Insulation capacity: 2.0
GL 535/N