SI 488
Product features
| Semiconductor casing: | TO-220 | |
| Semiconductor mounted by: | Screw | |
| Material | Silicon w. Glasfibre | |
| Min. thermal resistance [K/W]: | 1.0 | |
| Thickness [mm]: | 0.18 | |
| Insulation capacity: | 2.0 | |
| Dielectric coefficient | 2.0 |
Glass fibre reinforced silicone foil in combination with insulating bushes facilitate insulated mounting of semiconductors e.g. on heatsinks. They are highly flexible and ensure optimal heat conductivity even without using thermal compounds. - Colour: grey - Hardness: (Test ASTM D 2240) 85 Shore A - Elongation: (Test ASTM D 412) 2% - Tolerance: +/- 0,02 mm - Temperatur range: -60 / +200 °C - Thermal Conductivity: 0,9 W / mK - UL listed - Thickness: 0,18 mm - Rth: 0,33 K/W - Dielectric strength: app. 4 KV - Dielectric constant: 2,56 (at 10^6 Hz)
