12457_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material Alumnium Oxyde
Thickness / mm: 1.6
Insulation capacity: 10.0
Dielectric coefficient 9.0
AO 472
31071_1_Titel
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
SI7009-S
5621_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material Alumnium Oxyde
Thickness / mm: 1.5
Insulation capacity: 10.0
Dielectric coefficient 9.0
AO 471