31071_1_Titel
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Fragen zum Produkt
SI7009-S
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892_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material Alumnium Oxyde
Thickness [mm]: 3.0
Insulation capacity: 30.0
Dielectric coefficient 9.0
Fragen zum Produkt
AO 480
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34220_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Fragen zum Produkt
IK 552
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