
Semiconductor mounted by: | Screw | |
Material | Silicon w. Glasfibre | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.18 | |
Insulation capacity: | 2.0 | |
Dielectric coefficient | 2.0 |
SI7009-S
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Semiconductor casing: | TO-218 ; TOP-3 | |
Semiconductor mounted by: | Screw | |
Material | Alumnium Oxyde | |
Thickness [mm]: | 3.0 | |
Insulation capacity: | 30.0 | |
Dielectric coefficient | 9.0 |
AO 480
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Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Stick On ; Clip Mounting | |
Material | Silicon Rubber | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.3 | |
Insulation capacity: | 10.0 | |
Dielectric coefficient | 4.0 |
IK 552
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