31025_1_Titel
Semiconductor casing: SOT-32 ; TO-126
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7001
add to watchlist
31026_1_Titel
Semiconductor casing: SOT-32 ; TO-126
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7002
add to watchlist
31027_1_Titel
Semiconductor casing: TO-247
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7003
add to watchlist
31028_1_Titel
Semiconductor casing: TO-247
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7004
add to watchlist
31029_1_Titel
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7005
add to watchlist
31030_1_Titel
Semiconductor mounted by: Clip Mounting ; Bonding
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7006-S
add to watchlist
31031_1_Titel
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7007-S
add to watchlist
31032_1_Titel
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7008-S
add to watchlist
31071_1_Titel
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7009-S
add to watchlist
34220_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Questions on the product
IK 552
add to watchlist