31030_1_Titel
Semiconductor mounted by: Clip Mounting ; Bonding
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7006-S
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31031_1_Titel
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7007-S
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31032_1_Titel
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7008-S
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31071_1_Titel
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Questions on the product
SI7009-S
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34220_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Questions on the product
IK 552
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5829_1_Titel
Material Contains silicon
Content 250.0
Questions on the product
PA 700/250g
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6622_1_Titel
Material Contains silicon
Content 500.0
Questions on the product
PA 700/500g
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29388_1_Titel
Material Contains silicon
Content 50.0
Questions on the product
PA 700/50g
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29390_1_Titel
Material Contains silicon
Content 100.0
Questions on the product
PA 700/100g
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5839_1_Titel
Material Contains silicon
Content 10.0
Questions on the product
PA 700/10g
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