| Semiconductor casing: | TO-247 | |
| Semiconductor mounted by: | Screw | |
| Material | Silicon w. Glasfibre | |
| Min. thermal resistance [K/W]: | 1.0 | |
| Thickness [mm]: | 0.18 | |
| Insulation capacity: | 2.0 | |
| Dielectric coefficient | 2.0 |
| Semiconductor mounted by: | Screw | |
| Material | Silicon w. Glasfibre | |
| Min. thermal resistance [K/W]: | 1.0 | |
| Thickness [mm]: | 0.18 | |
| Insulation capacity: | 2.0 | |
| Dielectric coefficient | 2.0 |
| Semiconductor mounted by: | Clip Mounting ; Bonding | |
| Min. thermal resistance [K/W]: | 1.0 | |
| Thickness [mm]: | 0.18 | |
| Insulation capacity: | 2.0 | |
| Dielectric coefficient | 2.0 |
| Semiconductor mounted by: | Clip Mounting ; Bonding | |
| Material | Silicon w. Glasfibre | |
| Min. thermal resistance [K/W]: | 1.0 | |
| Thickness [mm]: | 0.18 | |
| Insulation capacity: | 2.0 | |
| Dielectric coefficient | 2.0 |
| Semiconductor mounted by: | Clip Mounting ; Bonding | |
| Material | Silicon w. Glasfibre | |
| Min. thermal resistance [K/W]: | 1.0 | |
| Thickness [mm]: | 0.18 | |
| Insulation capacity: | 2.0 | |
| Dielectric coefficient | 2.0 |
| Semiconductor mounted by: | Clip Mounting ; Bonding | |
| Material | Silicon w. Glasfibre | |
| Thickness [mm]: | 0.23 | |
| Dielectric coefficient | 2.0 |
| Semiconductor mounted by: | Screw | |
| Material | Silicon w. Glasfibre | |
| Min. thermal resistance [K/W]: | 1.0 | |
| Thickness [mm]: | 0.18 | |
| Insulation capacity: | 2.0 | |
| Dielectric coefficient | 2.0 |
