![12800_1_Titel](/media/uploads/img/_Titel/112800_Titel.gif)
Semiconductor casing: | TO-218 ; TOP-3 | |
Semiconductor mounted by: | Screw | |
Material | Silicon w. Glasfibre | |
Width [mm]: | 19.0 | |
Length [mm]: | 24.0 | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.23 | |
Insulation capacity: | 5.0 | |
Dielectric coefficient | 2.0 |
![2962_1_Titel](/media/uploads/img/_Titel/12962_Titel.gif)
Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Clip Mounting ; Bonding | |
Material | Silicon w. Glasfibre | |
Thickness [mm]: | 0.18 | |
Insulation capacity: | 2.0 | |
Dielectric coefficient | 2.0 |
![5452_1_Titel](/media/uploads/img/_Titel/15452_Titel.gif)
Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Clip Mounting ; Bonding | |
Material | Silicon w. Glasfibre | |
Thickness [mm]: | 0.23 | |
Insulation capacity: | 5.0 | |
Dielectric coefficient | 2.0 |
![5850_1_Titel](/media/uploads/img/_Titel/15850_Titel.gif)
Material | Silicon w. Glasfibre | |
Thickness [mm]: | 0.18 | |
Dielectric coefficient | 2.0 |
![5851_1_Titel](/media/uploads/img/_Titel/15851_Titel.gif)
Material | Silicon w. Glasfibre | |
Thickness [mm]: | 0.23 | |
Dielectric coefficient | 2.0 |
![5856_1_Titel](/media/uploads/img/_Titel/15856_Titel.gif)
Semiconductor casing: | TO-3 | |
Semiconductor mounted by: | Screw | |
Material | Silicon w. Glasfibre | |
Thickness [mm]: | 0.18 | |
Insulation capacity: | 2.0 | |
Dielectric coefficient | 2.0 |
![5857_1_Titel](/media/uploads/img/_Titel/15857_Titel.gif)
Semiconductor casing: | TO-3 | |
Semiconductor mounted by: | Screw | |
Material | Silicon w. Glasfibre | |
Thickness [mm]: | 0.23 | |
Insulation capacity: | 2.0 |
![5860_1_Titel](/media/uploads/img/_Titel/15860_Titel.gif)
Semiconductor casing: | SOT-32 | |
Semiconductor mounted by: | Screw | |
Material | Silicon w. Glasfibre | |
Min. thermal resistance [K/W]: | 3.0 | |
Thickness [mm]: | 0.18 | |
Insulation capacity: | 2.0 | |
Dielectric coefficient | 2.0 |
![5862_1_Titel](/media/uploads/img/_Titel/15862_Titel.gif)
Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Clip Mounting ; Bonding | |
Material | Silicon w. Glasfibre | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.18 | |
Insulation capacity: | 2.0 | |
Dielectric coefficient | 2.0 |
![5863_1_Titel](/media/uploads/img/_Titel/15863_Titel.gif)
Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Screw | |
Material | Silicon w. Glasfibre | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.18 | |
Insulation capacity: | 2.0 | |
Dielectric coefficient | 2.0 |