![5794_1_Titel](/media/uploads/img/_Titel/15794_Titel.png)
Semiconductor casing: | TO-3 | |
Semiconductor mounted by: | Screw | |
Material | MICA | |
Insulation capacity: | 2.0 | |
Temperature resistance | 550.0 |
![5799_1_Titel](/media/uploads/img/_Titel/15799_Titel.png)
Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Screw | |
Min. thermal resistance [K/W]: | 1.0 | |
Thickness [mm]: | 0.05 | |
Insulation capacity: | 2.0 | |
Temperature resistance | 550.0 |
![12389_1_Titel](/media/uploads/img/_Titel/112389_Titel.png)
Semiconductor casing: | TO-218 ; TOP-3 | |
Semiconductor mounted by: | Screw | |
Material | MICA | |
Thickness [mm]: | 0.05 | |
Insulation capacity: | 2.0 |