General parameters

Device mounted by


291_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting
Finish Bronzed
Material Spring Steel
MC 797
557_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting
Finish Bronzed
Material Spring Steel
MC 725
3069_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting
Material Stainless Steel
MC 780
11854_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting
Material Stainless Steel
MC 782
11855_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting
Material Stainless Steel
MC 786
12254_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting
Finish Bronzed
Material Spring Steel
MC 726
12255_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting
Finish Bronzed
Material Spring Steel
MC 773
14932_1_Titel
Semiconductor mounted by: Clip Mounting
Material Spring Steel
MC900
31383_1_Titel
Semiconductor mounted by: Clip Mounting
Cl ip Tool
34602_1_Titel
Semiconductor mounted by: Clip Mounting
Heat sink mounted by: Clip-On
Material Stainless Steel
MCU