SI 489
Product features
| Semiconductor casing: | TO-220 | |
| Semiconductor mounted by: | Screw | |
| Material | Silicon w. Glasfibre | |
| Min. thermal resistance [K/W]: | 1.0 | |
| Thickness [mm]: | 0.23 | |
| Insulation capacity: | 5.0 | |
| Dielectric coefficient | 2.0 |
Glass fiber reinforced silicone foil in combination with bushes facilitate insulated mounting of semiconductors e.g. on heatsinks. They are highly flexible and ensure optimal heat conductivity even without using thermal compounds. - Custom designed in all configurations (on request). - Cost saving assembly of different components onto a common insulator wafer. - Thickness: 0,23mm - Dielectric strength: app. 5 KV - Dielectric constant: 2,29 (by 10^6 Hz) - Hardness: (Test ASTM D 2240) 85 Shore A - Elongation: (Test ASTM D 412) 2% - Colour: grey - Tolerance: +/-0,02mm - Temperature range: -60 / +200 °C - Thermal Conductivity: 0,9 W / mK - UL listed
