SI 487-S
Product features
| Semiconductor casing: | TO-220 | |
| Semiconductor mounted by: | Clip Mounting ; Bonding | |
| Material | Silicon w. Glasfibre | |
| Min. thermal resistance [K/W]: | 1.0 | |
| Thickness [mm]: | 0.18 | |
| Insulation capacity: | 2.0 | |
| Dielectric coefficient | 2.0 |
Insulation wafer - silicone (Glass fibre reinforced) self-adhesive on one side, for clip mounting facilitate insulated mounting of semiconductors, e.g. to heatsinks. They are highly flexible and ensure optimal heat conductivity even without using thermal compounds.
