AO 475

Product features

Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Material Alumnium Oxyde
Thickness [mm]: 1.6
Insulation capacity: 10.0
Dielectric coefficient 9.0

Aluminium-oxide -wafers facilitate insulated mounting of semiconductors within high voltage ranges. In spit of high dielectric strength, a good heat conductivity i.e. from the semiconductor to the heatsink is given. - Dielectric strength: ca. 10 KV/mm - Dielectric loss tangent: 10^-4 (for 1MHz) - Dielectric constant: 9,1 (for 1 MHz) - Resistance: 10^14 Ohm x cm - Density: 3,9 g / cm3 - Purity: 96 % - Thermal resistance (Rth): 0,5 K/W (TO3)

Product pictures

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