IS 576
Product features
| Semiconductor casing: | TO-3 | |
| Semiconductor mounted by: | Screw | |
| Material | SR25 | |
| Diameter [mm]: | 7.0 | |
| Inner diameter [mm]: | 3.0 | |
| Outer diameter [mm]: | 4.0 | |
| Thickness [mm]: | 0.5 | |
| Insulation capacity: | 15.0 |
Insulating bush in combination with insulating wafers from mica or silicone foil facilitate insulated mounting of semiconductors to heat sinks or other components
