PO 50-50-25-AL-1

Product features

Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Blank Aluminium
Material Al99,5
Width [mm]: 50.0
Height [mm]: 25.0
Length [mm]: 50.0
Base height [mm]: 3.5
Min. thermal resistance [K/W]: 1.0
Unit Weight [g]: 49.0

Anzahl der Stifte:

0

RthK:

0

Product pictures

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