PO 50-50-20-AL

Product features

Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Blank Aluminium
Material Al99,5
Width [mm]: 50.0
Height [mm]: 20.0
Length [mm]: 50.0
Base height [mm]: 3.5
Min. thermal resistance [K/W]: 4.0
Unit Weight [g]: 42.0

Anzahl der Stifte:

169

RthK:

4,6 k/W (bei 12 W passiv); 1,2 k/W (bei 50 W belüftet 2m/s seitlich); 0,87 k/W (bei 65 W belüftet 2m/s von oben)

Product pictures

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