PO 50-50-25-AL-1

Product features

Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Width / mm: 50.0
Height / mm: 25.0
Länge / mm: 50.0
Base height / mm: 3.5
Min. thermal resistance / K/W: 1.0

Anzahl der Stifte:



Product pictures

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