Calculate thermal parameters
Heat sink temperature::
Thermal resistance:
Allowed junction temperature of the semiconductor
Heat resistance between heat sink and electrical package
Thermal dissipation loss
Heat resistance between heat sink and electrical package
Ambient temperature

Semiconductor casing: | TO-5 ; TO-39 ; TO-3 | |
Semiconductor mounted by: | Stick On | |
Heat sink mounted by: | Clip-On | |
Finish | Blank Aluminium | |
Material | AlMgSi0,5 | |
Length [mm]: | 9.0 | |
Min. thermal resistance [K/W]: | 54.0 |
FE 372/8/Al

Semiconductor casing: | TO-220 | |
Semiconductor mounted by: | Stick On | |
Heat sink mounted by: | Solder | |
Finish | Tin Plated | |
Material | AlMg3 |
CK 990/SN