FI 306/SN

Product features

Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Heat sink mounted by: Solder
Finish Tin Plated
Material AlMgSi0,5
Width / mm: 25.4
Height / mm: 29.3
Länge / mm: 12.7
Min. thermal resistance / K/W: 22.0

Standard heat sin for single device mounting

Product pictures

1 / 2
5745_1_Titel style=
2 / 2
5745_4_Detail1 style=
5745_1_Titel
5745_4_Detail1