PR 33/25,4/MC

Product features

Semiconductor casing: TO-218 ; TOP-3 ; TO-220
Semiconductor mounted by: Clip Mounting
Heat sink mounted by: Solder
Finish Black Anodised
Material AlMgSi0,5
Width / mm: 42.0
Height / mm: 25.0
Länge / mm: 25.4
Min. thermal resistance / K/W: 6.0

- Special extruded heatsink for semiconductor case TO220, TO218(TOP3) - Aluminium, anodised black, solderable - Standard heights: 25.4, 38.1, 50.8 and 63.5 mm - Version MC (Mounting clip) for clip mounting of semiconductor. - Heatsink solderable by tin plated solder pins

Product pictures

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