PR 7/23/SE

Product features

Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 6.3
Height [mm]: 4.8
Length [mm]: 23.0
Base height [mm]: 1.0
Min. thermal resistance [K/W]: 40.0

Aus Aluminium zum aufkleben. (Siehe Wärmeleitkleber WK 709) Standardlänge: 23,0 mm für 16 polig.

Product pictures

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