PR 7/8,5/SE

Product features

Semiconductor casing: DIL ; DIL 6/8 polig
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 6.4
Height [mm]: 4.8
Length [mm]: 8.5
Min. thermal resistance [K/W]: 80.0

- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive type WK 709. - Standard length: 8,5 mm for 6/8 pins - Other lengths and machining on request.

Product pictures

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