PR 8/6,3/SE

Product features

Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 6.3
Min. thermal resistance [K/W]: 50.0

- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive - Standard length: - 6,3 mm for 14/16 pins - 33 mm for 24 pins - 37 mm for 28 pins - 47 mm for 35 pins - 51 mm for 40 pins - Other lengths and machining on request.

Product pictures

1 / 2
3037_1_Titel style=
2 / 2
3037_4_Detail1 style=
3037_1_Titel
3037_4_Detail1