FI 310/SE

Product features

Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Width / mm: 46.0
Height / mm: 12.7
Länge / mm: 46.0
Min. thermal resistance / K/W: 7.0

Finger shaped heatsink, with no hole pattern, e.g. for semiconductor case TO3. Space saving construction. Turbulence in every installation position.

Product pictures

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