FI 340/31,8/SL/TO3

Product features

Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Material AlSiCu 3
Width / mm: 40.5
Height / mm: 31.8
Länge / mm: 46.0
Min. thermal resistance / K/W: 4.0

Finger shaped heatsink from die-casting aluminium with or without hole pattern for semiconductor case TO3. Standard heights: 12,7; 19,1; 25,4; and 31,8 mm. Space saving construction. Turbulence in every installation position.

Product pictures

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