PR 31/63/MC

Product features

Semiconductor casing: TO-220 ; TO-218 ; TOP-3
Semiconductor mounted by: Clip Mounting
Heat sink mounted by: Solder
Width / mm: 35.0
Height / mm: 25.4
Länge / mm: 63.0
Min. thermal resistance / K/W: 4.0

- Special extruded heatsink for semiconductor case TO220, TO218(TOP3) - Aluminium, anodised black, solderable - Standard heights: 38, 50 and 63 mm - Version MC (Mounting clip) for clip mounting of semiconductor. - Heatsink solderable by tin plated solder pins

Product pictures

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