PR 33/50,8/SE

Product features

Semiconductor casing: TO-220 ; TO-218 ; TOP-3
Semiconductor mounted by: Screw
Heat sink mounted by: Solder
Width / mm: 42.0
Height / mm: 25.0
Länge / mm: 50.8
Min. thermal resistance / K/W: 4.0

- Special extruded heatsink for semiconductor case TO220, TO218(TOP3) - Aluminium, anodised black, solderable - Standard heights: 25.4, 38.1, 50.8 and 63.5 mm - 2 x 3.2 mm holes for semiconductor assembly - Heatsink solderable by tin plated solder pins

Product pictures

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