PR 8/37/SE

Product features

Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Width / mm: 18.9
Height / mm: 4.8
Länge / mm: 37.0
Min. thermal resistance / K/W: 11.0

- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive - Standard length: - 6,3 mm for 14/16 pins - 33 mm for 24 pins - 37 mm for 28 pins - 47 mm for 35 pins - 51 mm for 40 pins - Other lengths and machining on request.

Product pictures

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