5837_1_Titel
Material Silicon free
Content 500.0
Questions on the product
PA 701/500g
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892_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material Alumnium Oxyde
Thickness [mm]: 3.0
Insulation capacity: 30.0
Dielectric coefficient 9.0
Questions on the product
AO 480
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29393_1_Titel
Material Silicon free
Content 100.0
Questions on the product
PA 701/100g
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