34220_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Stick On ; Clip Mounting
Material Silicon Rubber
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.3
Insulation capacity: 10.0
Dielectric coefficient 4.0
Questions on the product
IK 552
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29393_1_Titel
Material Silicon free
Content 100.0
Questions on the product
PA 704/100g
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5835_1_Titel
Material Silicon free
Content 250.0
Questions on the product
PA 704/250g
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5837_1_Titel
Material Silicon free
Content 500.0
Questions on the product
PA 704/500g
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29392_1_Titel
Material Silicon free
Content 50.0
Questions on the product
PA 704/50g
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892_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material Alumnium Oxyde
Thickness [mm]: 3.0
Insulation capacity: 30.0
Dielectric coefficient 9.0
Questions on the product
AO 480
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5844_1_Titel
Material Silicon free
Content 20.0
Questions on the product
PA 704/20g
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