IS 576

Product features

Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material SR25
Diameter [mm]: 7.0
Inner diameter [mm]: 3.1
Outer diameter [mm]: 3.9
Thickness [mm]: 0.4
Insulation capacity: 15.0

Insulating bush in combination with insulating wafers from mica or silicone foil facilitate insulated mounting of semiconductors to heat sinks or other components

Product pictures

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