SI 480

Product features

Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0

Glass fibre reinforced silicone foil in combination with insulating bushes facilitate insulated mounting of semiconductors e.g. on heatsinks. They are highly flexible and ensure optimal heat conductivity even without using thermal compounds. - Colour: grey - Hardness: (Test ASTM D 2240) 85 Shore A - Elongation: (Test ASTM D 412) 2% - Tolerance: +/- 0,02 mm - Temperatur range: -60 / +200 °C - Thermal Conductivity: 0,9 W / mK - UL listed - Thickness: 0,18 mm - Rth: 0,33 K/W - Dielectric strength: app. 4 KV - Dielectric constant: 2,56 (at 10^6 Hz)

Product pictures

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