SI 487-S

Product features

Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Min. thermal resistance [K/W]: 1.0
Thickness [mm]: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0

Insulation wafer - silicone (Glass fibre reinforced) self-adhesive on one side, for clip mounting facilitate insulated mounting of semiconductors, e.g. to heatsinks. They are highly flexible and ensure optimal heat conductivity even without using thermal compounds.

Product pictures

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